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从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
，更多细节参见同城约会
if (deflate.result) yield [deflate.result];
"Or consider pipeTo(). Each chunk passes through a full Promise chain: read, write, check backpressure, repeat. An {value, done} result object is allocated per read. Error propagation creates additional Promise branches.